Process Technician Wet Etch and Wafer Thinning 80-100% (f/m/d)

At Hitachi Energy our purpose is advancing a sustainable​ energy future for all. We bring power to our homes, schools, hospitals and factories. Join us and work with fantastic people, while learning and developing yourself on projects that have a real impact to our communities and society. Bring your passion, bring your energy, and be part of a global team that appreciates a simple truth: Diversity + Collaboration = Great Innovation

We are looking for a technical support for production as well as process development of the new generation of devices, with the focus on wet etching (Spray Batch Tools, Spin Wet Etching) and thin wafers (Wafer Thinning, Taiko Grinding). You are assisting the Process Engineers to establish new processes, solve issues in the production environment for both Si and SiC technologies. You are able to establish successful internal and external collaborations and work persistently to achieve common targets. In close collaboration with Operators and Wet Etch Team you are managing the daily high-volume production in your area.

Your responsibilities

• Supporting and sustaining of high-volume 24:7 semiconductor production, including on-call services
• Testing, controlling and optimization of single- and batch wet etch semiconductor processes, wafer thinning (including Taiko grinding) within BiMOS production (Wet Etch / Thinning area tools and related metrology) to gain better devices, yield and productivity
• Training of Operators (initial training, certifications and re-certifications)
• Taking care of related documentation like Working Instructions, Process Specifications and temporary guidelines
• Supporting an introduction of the new generation of power devices on 200 mm Si and 150 mm SiC wafers in volume production
• Working closely together with Process, Equipment and Maintenance Engineers to meet the production specifications, quality and enhance process- and tool stability
• Sharing responsibility for the development packages in cooperation with R&D and Product Engineering

Your background

• Technical vocational training (e.g. Technical School) or related experience in production-oriented semiconductor field
• More than 3 years of experience in semiconductor production environment
• Knowledge of one or multiple areas: Wet Etch (SAT/SST/single spin etcher), Chemical Treatments, Wafer Thinning is a big plus but not a must
• Basic experience with failure analysis and process control
• Proactive personality who is able to work in the team as well as autonomous
• Fluent English (B1) and German (B1)

More about us

Hitachi Energy is a global technology leader that is advancing a sustainable energy future for all. We serve customers in the utility, industry and infrastructure sectors with innovative solutions and services across the value chain. Together with customers and partners, we pioneer technologies and enable the digital transformation required to accelerate the energy transition towards a carbon-neutral future. We are advancing the world’s energy system to become more sustainable, flexible and secure whilst balancing social, environmental and economic value. Hitachi Energy has a proven track record and unparalleled installed base in more than 140 countries. Headquartered in Switzerland, we employ around 40,000 people in 90 countries and generate business volumes of approximately $10 billion USD. www.hitachienergy.com Interested in joining our team? If so, we look forward to receiving your full application (motivation letter, CV, references) only via our online careers tool. Hitachi Energy Switzerland Ltd. Peter Pankaczi Talent Acquisition

2023-03-13

CH55063014_E1