RoadPak SiC e-mobility module
The RoadPak is our newest innovative solution for all e-mobility applications. It enables the design of converters with lowest overall stray inductance, thanks to the latest generation of SiC MOSFET chipset and enhanced liquid cooling performance due to its pin-fin baseplate. In addition, the RoadPak allows very easy low inductive connections, thus the current rating of the inverters can be scaled up with just one module type. This allows the use of RoadPak in a well defined converter portfolio based on various performance classes. RoadPak applications include amongst others
- main drive train for xEVs
- e-trucks, e-busses
- traction auxiliary converters, as well as power electronics for xEV-charging
- 750 V
- 1200 V
Tvj (operational) up to 175 °C
|VCES (V)||ID (A)||RDS(on) (mΩ) typ. 25 °C||RDS(on) (mΩ) typ. 175 °C||Housing||Offer|
|5SFG 0660A07500x *||750||2 x 660||2.4||4.2||A||Request|
|5SFG 0880A07500x *||750||2 x 880||1.4||1.9||A||Request|
|5SFG 1100A07500x *||750||2 x 1100||1.1||1.5||A||Request|
* Contact factory
We recommend using the GD3160 Gate Driver from our partner NXP for RoadPak.
Why is the power semiconductor market migrating to SiC?
Submit your enquiry and we will contact you