Choose your region and language

Go

Menu

RoadPak SiC e-mobility module

The RoadPak is our newest innovative solution for all e-mobility applications. It enables the design of converters with lowest overall stray inductance, thanks to the latest generation of SiC MOSFET chipset and enhanced liquid cooling performance due to its pin-fin baseplate. In addition, the RoadPak allows very easy low inductive connections, thus the current rating of the inverters can be scaled up with just one module type. This allows the use of RoadPak in a well defined converter portfolio based on various performance classes. RoadPak applications include amongst others 

 

  • main drive train for xEVs
  • e-trucks, e-busses
  • traction auxiliary converters, as well as power electronics for xEV-charging 
Part number
Tvj (operational) up to 175 °C
VCES (V) ID (A) RDS(on) (mΩ) typ. 25 °C RDS(on) (mΩ) typ. 175 °C Housing Offer
5SFG 0660A07500x * 750 2 x 660 2.4 4.2 A Request
5SFG 0880A07500x * 750 2 x 880 1.4 1.9 A Request
5SFG 1100A07500x * 750 2 x 1100 1.1 1.5 A Request

* Contact factory

We recommend using the GD3160 Gate Driver from our partner NXP for RoadPak.

Learn more

Why is the power semiconductor market migrating to SiC?

Whitepaper: How to increase power rating with the right cooling strategy

Learn about the impact of various cooling methods on e-mobility modules.