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Press-pack IGBT and diode modules

StakPak is a family of high power insulated gate bipolar transistor (IGBT) press-packs and diodes in an advanced modular housing that guarantees uniform chip pressure in multiple-device stacks.

Although the most common package for IGBTs is the isolated module, for applications requiring series connection, press-packs are preferred because of the ease with which they can be connected electrically and mechanically in series and because of their inherent ability to conduct in the shorted state – an essential feature where redundancy is required. Since IGBTs feature multiple parallel chips, there is a challenge - with conventional press-packs - in assuring uniform pressure on all chips. This problem was solved with a new patented spring technology.

The StakPak, optimized for series connection, features a modular concept based on submodules fitted in a fiberglass reinforced frame, which allows a flexible realisation of a range of products for different current ratings and IGBT/diode ratios.

For downloading and printing of data sheets in PDF format, click on the part numbers. 

Part Number VCES (V) IC (A) VCESAT (V) typ.125 °C VF (V) typ.125 °C IGBT-to-diode ratio Housing Plecs model Offer
5SNA 1300K450300 4500 1300 3.4 2.4 1:1 K  XML Request
5SNA 2000K450300 4500 2000 3.4 2.4 1:1 K  XML Request
5SNA 2000K451300 4500 2000 3.65 3.0 2:1 K  XML Request
5SNA 2000K452300 4500 2000 3.65 3.0 2:1  XML Request
5SNA 3000K452300 4500 3000 3.65 3.0 2:1 K  XML Request
5SMA 3000L450300 4500  3000 3.1 - 1:0  L XML Request

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